Nickel electroplating solution

Nickel electroplating solution is designed for the fabrication of low stress, smooth and pinhole-free nickel films.

Synonyms: Ni electroplating solution; Ni plating solution

Purity: 0.015 g/L+/-0.0015 g/L (Wetting agent); 1.25 g/L+/-0.125 g/L (Stabilizer); 170 g/L+/-5 g/L (Ni(SO3NH2)2·4H2O ); 30 g/L+/-0.5 g/L (H3BO3); 4.25 g/L+/-0.25 g/L (Stress reducer); 9.51 g/L+/-1 g/L (NiBr2 ·xH2O)