High speed bright copper electroplating solution is an electrolytic acid copper process engineered for plating copper bumps, pads, patterns and redistribution layers as well as filling vials and trenches on wide varieties of substrates including semiconductors, glass, polymers et al. This copper electroplating solution is made up of cupric sulphate and sulphuric acid with small additions of hydrochloric acid and organic additives. The organic additives have a wide concentration process window eliminating the need for separate additive solutions and replenishment for about 120 Amp-hours of electroplating.
Purity: 40 mg/L+/-4 mg/L chloride basis; 600 mg/L+/-60 mg/L (organic additives); 65.0 g/L+/-2 g/L Cu basis; 8.0 g/L+/-0.4 g/L H2SO4 basis