Molecular Formula: C12H28O6P2
Molecular Weight: 330.29
Linear Structural Formula: C12H28O6P2
MDL Number: MFCD09836227
Purity: 98%
Melting Point: 181-187 C
Application: These products are used as linkers to improve adhesion between coatings and metal surfaces. The phosphonic acid groups can graft onto metal surface while the hydroxyl groups react with common epoxy/amine-based paints.
Legal Information: Product of SiKEMIA