Reagents, C, MilliporeSigma, UN3077, 7440-50-8
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Copper foil, thickness 0.025 mm, 99.98% trace metals basis
MilliporeSigmaMolecular Formula: Cu Molecular Weight: 63.55 Linear Structural Formula: Cu MDL Number: MFCD00010965 Purity: 99.98% trace metals basis Melting Point: 1083.4 C (lit.) Density: 8.94 g/mL at 25 C (lit.)
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For updated SDS information please visit www.goodfellow.com Synonyms: CU003804 Molecular Formula: Cu Molecular Weight: 63.55 Linear Structural Formula: Cu MDL Number: MFCD00010965 Melting Point: 1083.4 C (lit.) Density: 8.94 g/mL at 25 C (lit.) Legal Information: …
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Copper foil, thickness 1.0 mm, 99.999% trace metals basis
MilliporeSigmaCopper exhibits excellent thermal and electrical conductivities along with high malleability. Molecular Formula: Cu Molecular Weight: 63.55 Linear Structural Formula: Cu MDL Number: MFCD00010965 Purity: 99.999% trace metals basis Melting Point: 1083.4 C (lit.) Density: …
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Copper foil, thickness 0.5 mm, 99.98% trace metals basis
MilliporeSigmaMolecular Formula: Cu Molecular Weight: 63.55 Linear Structural Formula: Cu MDL Number: MFCD00010965 Purity: 99.98% trace metals basis Melting Point: 1083.4 C (lit.) Density: 8.94 g/mL at 25 C (lit.)
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For updated SDS information please visit www.goodfellow.com Synonyms: CU006022 Molecular Formula: Cu Molecular Weight: 63.55 Linear Structural Formula: Cu MDL Number: MFCD00010965 Purity: 99.8% Melting Point: 1083.4 C (lit.) Density: 8.94 g/mL at 25 C (lit.) Legal…
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Copper wire, diam. 2.0 mm, 99.999% trace metals basis
MilliporeSigmaMolecular Formula: Cu Molecular Weight: 63.55 Linear Structural Formula: Cu MDL Number: MFCD00010965 Purity: 99.999% trace metals basis Melting Point: 1083.4 C (lit.) Density: 8.94 g/mL at 25 C (lit.)
