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MilliporeSigma

Copper foil, thickness 1.0 mm, 99.999% trace metals basis

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Copper foil, thickness 1.0 mm, 99.999% trace metals basis

Copper exhibits excellent thermal and electrical conductivities along with high malleability.

Molecular Formula: Cu

Molecular Weight: 63.55

Linear Structural Formula: Cu

MDL Number: MFCD00010965

Purity: 99.999% trace metals basis

Melting Point: 1083.4 C (lit.)

Density: 8.94 g/mL at 25 C (lit.)

Application: A corrosion resistant graphene reinforced composite coating was deposited on 1.0mm thick copper foil by electrophoretic deposition.

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Product Detail
Thomas No.
CHM02G731
Mfr. No.
266744-1EA
Description
266744-1EA, Copper foil, thickness 1.0 mm, 99.999% trace metals basis
CAS Number
7440-50-8
UN Number
UN 3077
list price/quantitytotal
$0.00
$0.00 (0 Items)
Product is restricted and can only be purchased by customers with a web profile linked to a Thomas Business Account - Click here to login or create your web profile. If you do not have a Thomas Business Account, please Contact Us and someone will respond with details on how to apply for a business account with us.

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