7440-50-8
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Copper powder, -40+100 mesh, 99.5% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Powder Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper wire, 2.0mm dia., 99.999% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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For updated SDS information please visit www.goodfellow.com Synonyms: CU000640 Molecular Formula: Cu Molecular Weight: 63.55 Linear Structural Formula: Cu MDL Number: MFCD00010965 Purity: 99.9% Melting Point: 1083.4 C (lit.) Density: 8.94 g/mL at 25 C (lit.) Legal…
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For updated SDS information please visit www.goodfellow.com Synonyms: CU000700 Molecular Formula: Cu Molecular Weight: 63.55 Linear Structural Formula: Cu MDL Number: MFCD00010965 Purity: 99.9% Melting Point: 1083.4 C (lit.) Density: 8.94 g/mL at 25 C (lit.) Legal…
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Copper slug, 6.35mm dia. x 6.35mm length, 99.9999% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper rod, 9.5mm dia., 99.999% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper foil, 0.1mm thick, 99.999% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper powder, spherical, -100 mesh, 99.5% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 UN No: UN3089; Haz Class: 4.1; Packing Group: III Powder Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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For updated SDS information please visit www.goodfellow.com. Synonyms: Copper; CU005897 Molecular Formula: Cu Molecular Weight: 63.55 Linear Structural Formula: Cu MDL Number: MFCD00010965 Melting Point: 1083.4 C (lit.) Density: 8.94 g/mL at 25 C (lit.) Legal…
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Copper foil, thickness 0.5 mm, 99.98% trace metals basis
MilliporeSigmaMolecular Formula: Cu Molecular Weight: 63.55 Linear Structural Formula: Cu MDL Number: MFCD00010965 Purity: 99.98% trace metals basis Melting Point: 1083.4 C (lit.) Density: 8.94 g/mL at 25 C (lit.)
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Copper foil, thickness 0.025 mm, 99.98% trace metals basis
MilliporeSigmaMolecular Formula: Cu Molecular Weight: 63.55 Linear Structural Formula: Cu MDL Number: MFCD00010965 Purity: 99.98% trace metals basis Melting Point: 1083.4 C (lit.) Density: 8.94 g/mL at 25 C (lit.)
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Copper wire, 0.64mm dia., 99.999% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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For updated SDS information please visit www.goodfellow.com Synonyms: CU007920 Molecular Formula: Cu Molecular Weight: 63.55 Linear Structural Formula: Cu MDL Number: MFCD00010965 Purity: >=99.99% Melting Point: 1083.4 C (lit.) Density: 8.94 g/mL at 25 C (lit.) …
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Copper nanopowder, APS 20-50nm, 99.9% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 UN No: UN3089; Haz Class: 4.1; Packing Group: II Powder, CuO layer approx. 2nm Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper wire, 0.25mm dia., 99.995% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper foil, 0.05mm thick, 99.999% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper Thinfoil, Oxygen-Free High Conductivity (OFHC), 0.008mm (0.0003in) thick,…
Thermo Scientific ChemicalsPurity: 99.99% (metals basis) CAS Number: 7440-50-8 Harmonized Tariff Code: 7410.11
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Copper wire reel, 1000m, diameter 0.125mm, annealed, 99.9%
MilliporeSigmaFor updated SDS information please visit www.goodfellow.com. Synonyms: Copper; CU005250 Molecular Formula: Cu Molecular Weight: 63.55 Linear Structural Formula: Cu MDL Number: MFCD00010965 Purity: 99.9% Melting Point: 1083.4 C (lit.) Density: 8.94 g/mL at 25 C (lit.)…
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For updated SDS information please visit www.goodfellow.com Synonyms: CU006024 Molecular Formula: Cu Molecular Weight: 63.55 Linear Structural Formula: Cu MDL Number: MFCD00010965 Purity: 99% Melting Point: 1083.4 C (lit.) Density: 8.94 g/mL at 25 C (lit.) Legal…
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Copper foil, 0.025mm (0.001in) thick, annealed, uncoated, 99.8% (metals basis)
Thermo Scientific ChemicalsPurity: 99.8% (metals basis) CAS Number: 7440-50-8 Harmonized Tariff Code: 7410.11
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Copper foil, 0.25mm (0.01in) thick, Puratronic r, 99.9985% (metals basis)
Thermo Scientific ChemicalsPurity: 99.9985% (metals basis) CAS Number: 7440-50-8 Harmonized Tariff Code: 7409.19
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Copper wire reel, 2000m, diameter 0.1mm, annealed, 99.9%
MilliporeSigmaFor updated SDS information please visit www.goodfellow.com. Synonyms: Copper; CU005240 Molecular Formula: Cu Molecular Weight: 63.55 Linear Structural Formula: Cu MDL Number: MFCD00010965 Purity: 99.9% Melting Point: 1083.4 C (lit.) Density: 8.94 g/mL at 25 C (lit.)…
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Copper foil, thickness 1.0 mm, 99.999% trace metals basis
MilliporeSigmaCopper exhibits excellent thermal and electrical conductivities along with high malleability. Molecular Formula: Cu Molecular Weight: 63.55 Linear Structural Formula: Cu MDL Number: MFCD00010965 Purity: 99.999% trace metals basis Melting Point: 1083.4 C (lit.) Density: …
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Copper foil, 0.254mm (0.010in) thick, 99.9% (metals basis)
Thermo Scientific ChemicalsPurity: 99.9% (metals basis) CAS Number: 7440-50-8 Harmonized Tariff Code: 7409.19
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Copper foil, 0.025mm thick, annealed, coated, 99.8% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper wire reel, 100m, diameter 0.05mm, annealed, 99.9%
MilliporeSigmaFor updated SDS information please visit www.goodfellow.com. Synonyms: Copper; CU005215 Molecular Formula: Cu Molecular Weight: 63.55 Linear Structural Formula: Cu MDL Number: MFCD00010965 Purity: >=99.9% Melting Point: 1083.4 C (lit.) Density: 8.94 g/mL at 25 C…
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Copper foil, 1.0mm (0.04in) thick, 99.99% (metals basis)
Thermo Scientific ChemicalsPurity: 99.99% (metals basis) CAS Number: 7440-50-8 Harmonized Tariff Code: 7409.19
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CAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper gauze, 140 mesh woven from 0.56mm (0.0022in) dia wire
Thermo Scientific ChemicalsCAS Number: 7440-50-8 Harmonized Tariff Code: 7419.99
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For updated SDS information please visit www.goodfellow.com Synonyms: CU000580 Molecular Formula: Cu Molecular Weight: 63.55 Linear Structural Formula: Cu MDL Number: MFCD00010965 Purity: 99.95% Melting Point: 1083.4 C (lit.) Density: 8.94 g/mL at 25 C (lit.) …
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Copper slug, 6.35mm dia. x 12.7mm length, 99.9999% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94