BeanTown Chemical, 7440-50-8, 500 g
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Copper rod, 9.5mm dia., 99.999% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper powder, -325 mesh, 99% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 UN No: UN3089; Haz Class: 4.1; Packing Group: III 8-11 micron APS Powder (FSSS) Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper powder, -40+100 mesh, 99.5% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Powder Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper shot, 13mm dia., 99.99% trace metals basis, oxygen free
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper flake, -325 mesh
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 UN No: UN3089; Haz Class: 4.1; Packing Group: III Solid, average thickness 1-2 microns Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper shot, 1-10mm, 99.9% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper flake, 1-5 micron, 99.9% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 UN No: UN3089; Haz Class: 4.1; Packing Group: III Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper powder, spherical, -170+270 mesh, 99.9% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 UN No: UN3089; Haz Class: 4.1; Packing Group: III Powder Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
