Metals Oxides, 7440-50-8, 50 x 50 mm, Chemicals
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Copper foil, 0.25mm thick, 99.995% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper foil, 0.127mm thick, annealed, 99.999% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper foil, 1.0mm thick, 99.9999% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper foil, 1.0mm thick, 99.99% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper foil, 0.5mm thick, 99.995% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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CAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper foil, 2.0mm thick, 99.999% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper foil, 0.05mm thick, 99.999% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper foil, 0.1mm thick, 99.9999% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper foil, 0.25mm thick, 99.9999% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper foil, 0.1mm thick, 99.999% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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CAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper foil, 0.5mm thick, 99.9999% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
