7440-50-8, Metals Oxides
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Copper powder, -325 mesh, 99% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 UN No: UN3089; Haz Class: 4.1; Packing Group: III 8-11 micron APS Powder (FSSS) Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper foil, 0.1mm thick, 99.9999% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper wire, 0.25mm dia., 99.995% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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CAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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EMSURE® Copper fine powder particle size < 63 µm
MilliporeSigmaSynonyms: CX1925-4, CX1925 Chemical Formula: Cu Hill Formula: Cu CAS Number: 7440-50-8 UN Number: UN3089
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Copper powder, -40+100 mesh, 99.5% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Powder Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper slug, 6.35mm dia. x 6.35mm length, 99.9999% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper foil, 0.675mm thick, annealed, 99.9% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper powder, spherical, -100 mesh, 99.5% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 UN No: UN3089; Haz Class: 4.1; Packing Group: III Powder Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper foil, 0.25mm thick, 99.995% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper wire, 0.25mm dia., 99.9999% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper slug, 3.175mm dia. x 3.175mm length, 99.9999% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper foil, 0.025mm thick, annealed, coated, 99.8% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper foil, 0.127mm thick, annealed, 99.999% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper foil, 0.5mm thick, 99.995% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper flake, 1-5 micron, 99.9% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 UN No: UN3089; Haz Class: 4.1; Packing Group: III Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper turnings, 99% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper powder, spherical, -170+270 mesh, 99.9% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 UN No: UN3089; Haz Class: 4.1; Packing Group: III Powder Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper wire, 1.0mm dia., 99.9999% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper slug, 6.35mm dia. x 6.35mm length, 99.995% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper shot, 13mm dia., 99.99% trace metals basis, oxygen free
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper gauze, 40 mesh woven from 0.056mm dia. wire
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Wire Cloth Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper foil, 1.0mm thick, 99.99% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper foil, 0.025mm thick, 99.999% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper powder, spherical, APS 10 micron, 99.9% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 UN No: UN3089; Haz Class: 4.1; Packing Group: III Powder Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper foil, 2.0mm thick, 99.999% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper foil, 0.25mm thick, 99.9999% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper wire, 0.64mm dia., 99.999% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper foil, 1.0mm thick, 99.9999% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94