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CAS: 7440-50-8
EC No: 231-159-6
MDL No: MFCD00010965
RTECS: GL5325000
UN No: UN3089; Haz Class: 4.1; Packing Group: II
Powder, CuO layer approx. 2nm
Molecular Formula: Cu
MW: 63.55
Melting Point: 1083.4°
Boiling Point: 2567°
Density (g/mL): 8.94