Reagents, E, UN3082
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Electroless nickel plating solution ammonia type
MilliporeSigmaImproved standard electroless nickel plating composition specific for making ohmic contacts to silicon and other semiconductor materials.Advantages: •Stable, ready to use •Plates uniformly on p- and n- type silicon •Offers excellent adhesion and solderability •Plates on silicon, germanium,…
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Electroless nickel plating strike
MilliporeSigmaAn electroless nickel plating process designed for electroless nickel plating on copper, brass and copper alloyCLEANING PROCEDURE FOR COPPER SAMPLES:1. Clean copper with some physical abrasion.2. Dip for one minute in alkaline cleaner at 65C (150F).3. Rinse with deionized water.4. Dip for one…
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Efavirenz Ready Made Solution 10 mg/mL in DMSO
MilliporeSigmaSynonyms: (4S)-6-Chloro-4-(2-cyclopropylethynyl)-4-(trifluoromethyl)-2,4-dihydro-1H-3,1-benzoxazin-2-one; (4S)-6-Chloro-4-(2-cyclopropylethynyl)-1,4-dihydro-4-(trifluoromethyl)-2H-3,1-benzoxazin-2-one Molecular Formula: C14H9ClF3NO2 Molecular Weight: 315.67 Linear Structural Formula: …
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1-Triethylsilyl-4-(triethylsilyloxy)-1-butyne, 96%
GFS Chemicals(C2H5)3SiO(CH2)2C≡CSi(C2H5)3 CAS#: 160194-28-5 F.W.: 298.62
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