Metals Oxides, UN3089, 7440-50-8
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Copper powder, spherical, -170+270 mesh, 99.9% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 UN No: UN3089; Haz Class: 4.1; Packing Group: III Powder Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper nanopowder, APS 20-50nm, 99.9% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 UN No: UN3089; Haz Class: 4.1; Packing Group: II Powder, CuO layer approx. 2nm Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper flake, -325 mesh
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 UN No: UN3089; Haz Class: 4.1; Packing Group: III Solid, average thickness 1-2 microns Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper powder, spherical, APS 10 micron, 99.9% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 UN No: UN3089; Haz Class: 4.1; Packing Group: III Powder Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper flake, 1-5 micron, 99.9% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 UN No: UN3089; Haz Class: 4.1; Packing Group: III Solid Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper powder, -100 mesh, 99.999% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 UN No: UN3089; Haz Class: 4.1; Packing Group: III Powder Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper powder, spherical, -100 mesh, 99.5% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 UN No: UN3089; Haz Class: 4.1; Packing Group: III Powder Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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Copper powder, -325 mesh, 99% trace metals basis
BeanTown ChemicalCAS: 7440-50-8 EC No: 231-159-6 MDL No: MFCD00010965 RTECS: GL5325000 UN No: UN3089; Haz Class: 4.1; Packing Group: III 8-11 micron APS Powder (FSSS) Molecular Formula: Cu MW: 63.55 Melting Point: 1083.4° Boiling Point: 2567° Density (g/mL): 8.94
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EMSURE® Copper fine powder particle size < 63 µm
MilliporeSigmaSynonyms: CX1925-4, CX1925 Chemical Formula: Cu Hill Formula: Cu CAS Number: 7440-50-8 UN Number: UN3089
